At the annual Huawei Connect conference in Shanghai, Huawei unveiled a bold three-year roadmap for its Ascend AI chips, intensifying its direct competition with industry leader Nvidia. The company introduced plans for next-generation Atlas computing supernodes and showcased proprietary technology breakthroughs that aim to bolster China's domestic semiconductor capabilities and reduce reliance on U.S. supply chains[2].
A key highlight is Huawei’s own high-bandwidth memory, integrated into the Ascend 950, representing a removal of previous bottlenecks that forced dependence on South Korean and U.S. suppliers. This proprietary memory is seen as a critical step toward achieving semiconductor self-sufficiency within China[2].
Performance assessments from SemiAnalysis indicate that Huawei’s new architecture can outperform Nvidia’s GB200 NVL72 in select workloads, thanks to its “supernode” design enabling extremely high-speed chip-to-chip communication[2].
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